JPH0741194Y2 - 金属基板とケースとの組合わせ構造 - Google Patents
金属基板とケースとの組合わせ構造Info
- Publication number
- JPH0741194Y2 JPH0741194Y2 JP1989012406U JP1240689U JPH0741194Y2 JP H0741194 Y2 JPH0741194 Y2 JP H0741194Y2 JP 1989012406 U JP1989012406 U JP 1989012406U JP 1240689 U JP1240689 U JP 1240689U JP H0741194 Y2 JPH0741194 Y2 JP H0741194Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- metal substrate
- terminals
- terminal
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 title claims description 38
- 229910052751 metal Inorganic materials 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 37
- 238000005476 soldering Methods 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 210000000078 claw Anatomy 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Multi-Conductor Connections (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989012406U JPH0741194Y2 (ja) | 1989-02-03 | 1989-02-03 | 金属基板とケースとの組合わせ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989012406U JPH0741194Y2 (ja) | 1989-02-03 | 1989-02-03 | 金属基板とケースとの組合わせ構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02104691U JPH02104691U (en]) | 1990-08-20 |
| JPH0741194Y2 true JPH0741194Y2 (ja) | 1995-09-20 |
Family
ID=31221825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989012406U Expired - Lifetime JPH0741194Y2 (ja) | 1989-02-03 | 1989-02-03 | 金属基板とケースとの組合わせ構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741194Y2 (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3675719B2 (ja) * | 2001-01-19 | 2005-07-27 | 日本電気株式会社 | 電子機器内部実装基板の低インピーダンス実装方法及び実装構造 |
| US7130198B2 (en) * | 2001-12-06 | 2006-10-31 | Rohm Co., Ltd. | Resin-packaged protection circuit module for rechargeable batteries and method of making the same |
| CN101151944B (zh) * | 2005-03-28 | 2010-12-08 | 古河电气工业株式会社 | 金属芯板的加强结构和电连接箱 |
| JP4995527B2 (ja) * | 2006-09-28 | 2012-08-08 | 日本電波工業株式会社 | 表面実装用の圧電発振器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587671U (ja) * | 1981-07-07 | 1983-01-18 | 株式会社松井色素化学工業所 | 転写捺染シ−ト |
-
1989
- 1989-02-03 JP JP1989012406U patent/JPH0741194Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02104691U (en]) | 1990-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |